Factory Lead Time  

17 Weeks

Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-SOIC (0.154, 3.90mm Width)

Number of Pins  

8

Weight  

73.992255mg

Transistor Element Material  

SILICON

Number of Elements  

2

Turn Off Delay Time  

15.4 ns

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Published  

2010

JESD-609 Code  

e3

Pbfree Code  

yes

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

8

ECCN Code  

EAR99

Additional Feature  

HIGH RELIABILITY

Max Power Dissipation  

1.8W

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

DMN4027SSD

Pin Count  

8

Element Configuration  

Dual

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

2.1W

Turn On Delay Time  

3.1 ns

FET Type  

2 N-Channel (Dual)

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

27m Ω @ 7A, 10V

Vgs(th) (Max) @ Id  

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

604pF @ 20V

Gate Charge (Qg) (Max) @ Vgs  

12.9nC @ 10V

Rise Time  

3.1ns

Drain to Source Voltage (Vdss)  

40V

Fall Time (Typ)  

7.5 ns

Continuous Drain Current (ID)  

5.4A

Gate to Source Voltage (Vgs)  

20V

Drain Current-Max (Abs) (ID)  

7.1A

Drain to Source Breakdown Voltage  

40V

FET Technology  

METAL-OXIDE SEMICONDUCTOR

FET Feature  

Logic Level Gate

Height  

1.5mm

Length  

5mm

Width  

4mm

REACH SVHC  

No SVHC

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant